Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear

Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear

10.1016/j.wear.2006.11.030

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Bibliographic Details
Main Authors: Cai, M.B., Li, X.P., Rahman, M.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Dynamic hard particles
Groove wear
Molecular dynamics
Nanoscale cutting
Silicon
Online Access:http://scholarbank.nus.edu.sg/handle/10635/59684
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Institution: National University of Singapore
Description
Summary:10.1016/j.wear.2006.11.030

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