Cai, M., Li, X., Rahman, M., & ENGINEERING, M. (2014). Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear.
Chicago Style CitationCai, M.B., X.P Li, M. Rahman, and MECHANICAL ENGINEERING. Characteristics of "dynamic Hard Particles" in Nanoscale Ductile Mode Cutting of Monocrystalline Silicon With Diamond Tools in Relation to Tool Groove Wear. 2014.
MLA引文Cai, M.B., X.P Li, M. Rahman, and MECHANICAL ENGINEERING. Characteristics of "dynamic Hard Particles" in Nanoscale Ductile Mode Cutting of Monocrystalline Silicon With Diamond Tools in Relation to Tool Groove Wear. 2014.
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