Effect of milling on the damping behavior of nano-structured copper

Effect of milling on the damping behavior of nano-structured copper

10.1016/j.msea.2003.08.064

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Bibliographic Details
Main Authors: Srikanth, N., Thein, M.A., Gupta, M.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Anelasticity
Grain boundary
Interface
Nano-material
Non-destructive testing
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60057
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/60057

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