Nai, S., Wei, J., Gupta, M., & ENGINEERING, M. (2014). Interfacial intermetallic growth and shear strength of lead-free composite solder joints.
استشهاد بنمط شيكاغوNai, S.M.L., J. Wei, M. Gupta, و MECHANICAL ENGINEERING. Interfacial Intermetallic Growth and Shear Strength of Lead-free Composite Solder Joints. 2014.
MLA استشهادNai, S.M.L., J. Wei, M. Gupta, و MECHANICAL ENGINEERING. Interfacial Intermetallic Growth and Shear Strength of Lead-free Composite Solder Joints. 2014.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.