Non-destructive characterization of resin-based filling materials using Electronic Speckle Pattern Interferometry

Non-destructive characterization of resin-based filling materials using Electronic Speckle Pattern Interferometry

10.1016/j.dental.2003.06.002

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Bibliographic Details
Main Authors: Yap, A.U.J., Tan, A.C.S., Quan, C.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Composite resin
Dental material
Electronic speckle pattern interferometry
Flexural
Interferometry
Modulus
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60886
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/60886

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