Wafer-level BCB bonding using a thermal press for microfluidics

10.1007/s00542-008-0712-2

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Main Authors:	Zhou, X., Virasawmy, S., Quan, C.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/61686
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-61686
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spelling	sg-nus-scholar.10635-616862023-10-25T23:09:59Z Wafer-level BCB bonding using a thermal press for microfluidics Zhou, X. Virasawmy, S. Quan, C. MECHANICAL ENGINEERING SINGAPORE SYNCHROTRON LIGHT SOURCE 10.1007/s00542-008-0712-2 Microsystem Technologies 15 4 573-580 2014-06-17T06:38:07Z 2014-06-17T06:38:07Z 2009-04 Article Zhou, X., Virasawmy, S., Quan, C. (2009-04). Wafer-level BCB bonding using a thermal press for microfluidics. Microsystem Technologies 15 (4) : 573-580. ScholarBank@NUS Repository. https://doi.org/10.1007/s00542-008-0712-2 09467076 http://scholarbank.nus.edu.sg/handle/10635/61686 000262676300011 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1007/s00542-008-0712-2
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Zhou, X. Virasawmy, S. Quan, C.
format	Article
author	Zhou, X. Virasawmy, S. Quan, C.
spellingShingle	Zhou, X. Virasawmy, S. Quan, C. Wafer-level BCB bonding using a thermal press for microfluidics
author_sort	Zhou, X.
title	Wafer-level BCB bonding using a thermal press for microfluidics
title_short	Wafer-level BCB bonding using a thermal press for microfluidics
title_full	Wafer-level BCB bonding using a thermal press for microfluidics
title_fullStr	Wafer-level BCB bonding using a thermal press for microfluidics
title_full_unstemmed	Wafer-level BCB bonding using a thermal press for microfluidics
title_sort	wafer-level bcb bonding using a thermal press for microfluidics
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/61686
_version_	1781782100592033792

Wafer-level BCB bonding using a thermal press for microfluidics

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