High-performance CPW fillers use bond wires

Microwaves and RF

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Bibliographic Details
Main Authors:	Sivanand, K., Uysal, S., Eccleston, K.W.
Other Authors:	ELECTRICAL ENGINEERING
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/62287
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-62287
record_format	dspace
spelling	sg-nus-scholar.10635-622872015-01-21T17:47:27Z High-performance CPW fillers use bond wires Sivanand, K. Uysal, S. Eccleston, K.W. ELECTRICAL ENGINEERING Microwaves and RF 36 6 89-92 MIRFD 2014-06-17T06:49:25Z 2014-06-17T06:49:25Z 1997 Article Sivanand, K.,Uysal, S.,Eccleston, K.W. (1997). High-performance CPW fillers use bond wires. Microwaves and RF 36 (6) : 89-92. ScholarBank@NUS Repository. 07452993 http://scholarbank.nus.edu.sg/handle/10635/62287 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Microwaves and RF
author2	ELECTRICAL ENGINEERING
author_facet	ELECTRICAL ENGINEERING Sivanand, K. Uysal, S. Eccleston, K.W.
format	Article
author	Sivanand, K. Uysal, S. Eccleston, K.W.
spellingShingle	Sivanand, K. Uysal, S. Eccleston, K.W. High-performance CPW fillers use bond wires
author_sort	Sivanand, K.
title	High-performance CPW fillers use bond wires
title_short	High-performance CPW fillers use bond wires
title_full	High-performance CPW fillers use bond wires
title_fullStr	High-performance CPW fillers use bond wires
title_full_unstemmed	High-performance CPW fillers use bond wires
title_sort	high-performance cpw fillers use bond wires
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/62287
_version_	1681085748283965440

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