Analytical solution for compression stiffness of bonded rectangular layers

10.1016/S0020-7683(00)00057-3

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Bibliographic Details
Main Authors: Koh, C.G., Lim, H.L.
Other Authors: CIVIL ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/65151
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Institution: National University of Singapore