Efficient analysis for multilayer power-ground planes with multiple vias and signal traces in an advanced electronic package

Efficient analysis for multilayer power-ground planes with multiple vias and signal traces in an advanced electronic package

10.1109/EPEP.2008.4675886

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Bibliographic Details
Main Authors: Oo, Z.Z., Wei, X.-C., Liu, E.-X., Li, E.-P., Li, L.-W.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/70100
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/70100

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