RBF-based compensation method on displacement and thermal error

10.1109/ICMA.2013.6618058

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Bibliographic Details
Main Authors: Tan, K.K., Yang, R., Er, P.V., Tay, A., Teo, C.S.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/71555
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Institution: National University of Singapore