APA引文

Yiang, K., Mok, T., Yoo, W., Krishnamoorthy, A., & ENGINEERING, E. &. C. (2014). Reliability improvement using buried capping layer in advanced interconnects.

Chicago Style Citation

Yiang, K.Y., T.S Mok, W.J Yoo, A. Krishnamoorthy, and ELECTRICAL & COMPUTER ENGINEERING. Reliability Improvement Using Buried Capping Layer in Advanced Interconnects. 2014.

MLA引文

Yiang, K.Y., et al. Reliability Improvement Using Buried Capping Layer in Advanced Interconnects. 2014.