Thermal-aware electrical analysis of high-speed interconnect
10.1109/EDAPS.2008.4736027
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2014
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sg-nus-scholar.10635-720152023-10-26T08:47:33Z Thermal-aware electrical analysis of high-speed interconnect Liu, E.-X. Li, E.-P. Wei, X. ELECTRICAL & COMPUTER ENGINEERING 10.1109/EDAPS.2008.4736027 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings 171-174 2014-06-19T03:30:28Z 2014-06-19T03:30:28Z 2008 Conference Paper Liu, E.-X., Li, E.-P., Wei, X. (2008). Thermal-aware electrical analysis of high-speed interconnect. 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings : 171-174. ScholarBank@NUS Repository. https://doi.org/10.1109/EDAPS.2008.4736027 9781424426331 http://scholarbank.nus.edu.sg/handle/10635/72015 000265245200045 Scopus |
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Asia |
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Singapore Singapore |
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| description |
10.1109/EDAPS.2008.4736027 |
| author2 |
ELECTRICAL & COMPUTER ENGINEERING |
| author_facet |
ELECTRICAL & COMPUTER ENGINEERING Liu, E.-X. Li, E.-P. Wei, X. |
| format |
Conference or Workshop Item |
| author |
Liu, E.-X. Li, E.-P. Wei, X. |
| spellingShingle |
Liu, E.-X. Li, E.-P. Wei, X. Thermal-aware electrical analysis of high-speed interconnect |
| author_sort |
Liu, E.-X. |
| title |
Thermal-aware electrical analysis of high-speed interconnect |
| title_short |
Thermal-aware electrical analysis of high-speed interconnect |
| title_full |
Thermal-aware electrical analysis of high-speed interconnect |
| title_fullStr |
Thermal-aware electrical analysis of high-speed interconnect |
| title_full_unstemmed |
Thermal-aware electrical analysis of high-speed interconnect |
| title_sort |
thermal-aware electrical analysis of high-speed interconnect |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/72015 |
| _version_ |
1781783236596203520 |