A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology

2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics

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Bibliographic Details
Main Authors: Liu, J., Cao, L., Xie, M., Goh, T.-N., Tang, Y.
Other Authors: INDUSTRIAL & SYSTEMS ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/72237
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-722372015-04-09T22:29:37Z A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology Liu, J. Cao, L. Xie, M. Goh, T.-N. Tang, Y. INDUSTRIAL & SYSTEMS ENGINEERING 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics 191-197 2014-06-19T04:52:39Z 2014-06-19T04:52:39Z 2004 Conference Paper Liu, J.,Cao, L.,Xie, M.,Goh, T.-N.,Tang, Y. (2004). A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology. 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 191-197. ScholarBank@NUS Repository. 0780387449 http://scholarbank.nus.edu.sg/handle/10635/72237 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics
author2 INDUSTRIAL & SYSTEMS ENGINEERING
author_facet INDUSTRIAL & SYSTEMS ENGINEERING
Liu, J.
Cao, L.
Xie, M.
Goh, T.-N.
Tang, Y.
format Conference or Workshop Item
author Liu, J.
Cao, L.
Xie, M.
Goh, T.-N.
Tang, Y.
spellingShingle Liu, J.
Cao, L.
Xie, M.
Goh, T.-N.
Tang, Y.
A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology
author_sort Liu, J.
title A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology
title_short A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology
title_full A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology
title_fullStr A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology
title_full_unstemmed A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology
title_sort general weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/72237
_version_ 1681087529325953024