A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology
2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics
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2014
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sg-nus-scholar.10635-722372015-04-09T22:29:37Z A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology Liu, J. Cao, L. Xie, M. Goh, T.-N. Tang, Y. INDUSTRIAL & SYSTEMS ENGINEERING 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics 191-197 2014-06-19T04:52:39Z 2014-06-19T04:52:39Z 2004 Conference Paper Liu, J.,Cao, L.,Xie, M.,Goh, T.-N.,Tang, Y. (2004). A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology. 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 191-197. ScholarBank@NUS Repository. 0780387449 http://scholarbank.nus.edu.sg/handle/10635/72237 NOT_IN_WOS Scopus |
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2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics |
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INDUSTRIAL & SYSTEMS ENGINEERING |
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INDUSTRIAL & SYSTEMS ENGINEERING Liu, J. Cao, L. Xie, M. Goh, T.-N. Tang, Y. |
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Conference or Workshop Item |
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Liu, J. Cao, L. Xie, M. Goh, T.-N. Tang, Y. |
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Liu, J. Cao, L. Xie, M. Goh, T.-N. Tang, Y. A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology |
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Liu, J. |
title |
A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology |
title_short |
A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology |
title_full |
A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology |
title_fullStr |
A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology |
title_full_unstemmed |
A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology |
title_sort |
general weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology |
publishDate |
2014 |
url |
http://scholarbank.nus.edu.sg/handle/10635/72237 |
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1681087529325953024 |