3D visual inspection of IC bonding wires
10.1117/12.284030
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sg-nus-scholar.10635-724342024-11-14T09:11:19Z 3D visual inspection of IC bonding wires Ong, S.H. Han, X. Ye, Q.Z. ELECTRICAL ENGINEERING 3d inspection Curve matching Stereo vision Wire bond inspection 10.1117/12.284030 Proceedings of SPIE - The International Society for Optical Engineering 3185 68-77 PSISD 2014-06-19T05:08:01Z 2014-06-19T05:08:01Z 1997 Conference Paper Ong, S.H., Han, X., Ye, Q.Z. (1997). 3D visual inspection of IC bonding wires. Proceedings of SPIE - The International Society for Optical Engineering 3185 : 68-77. ScholarBank@NUS Repository. https://doi.org/10.1117/12.284030 0277786X http://scholarbank.nus.edu.sg/handle/10635/72434 A1997BJ98D00008 Scopus |
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3d inspection Curve matching Stereo vision Wire bond inspection |
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3d inspection Curve matching Stereo vision Wire bond inspection Ong, S.H. Han, X. Ye, Q.Z. 3D visual inspection of IC bonding wires |
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10.1117/12.284030 |
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ELECTRICAL ENGINEERING |
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ELECTRICAL ENGINEERING Ong, S.H. Han, X. Ye, Q.Z. |
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Conference or Workshop Item |
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Ong, S.H. Han, X. Ye, Q.Z. |
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Ong, S.H. |
title |
3D visual inspection of IC bonding wires |
title_short |
3D visual inspection of IC bonding wires |
title_full |
3D visual inspection of IC bonding wires |
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3D visual inspection of IC bonding wires |
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3D visual inspection of IC bonding wires |
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3d visual inspection of ic bonding wires |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/72434 |
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