3D visual inspection of IC bonding wires

10.1117/12.284030

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Bibliographic Details
Main Authors: Ong, S.H., Han, X., Ye, Q.Z.
Other Authors: ELECTRICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/72434
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-724342024-11-14T09:11:19Z 3D visual inspection of IC bonding wires Ong, S.H. Han, X. Ye, Q.Z. ELECTRICAL ENGINEERING 3d inspection Curve matching Stereo vision Wire bond inspection 10.1117/12.284030 Proceedings of SPIE - The International Society for Optical Engineering 3185 68-77 PSISD 2014-06-19T05:08:01Z 2014-06-19T05:08:01Z 1997 Conference Paper Ong, S.H., Han, X., Ye, Q.Z. (1997). 3D visual inspection of IC bonding wires. Proceedings of SPIE - The International Society for Optical Engineering 3185 : 68-77. ScholarBank@NUS Repository. https://doi.org/10.1117/12.284030 0277786X http://scholarbank.nus.edu.sg/handle/10635/72434 A1997BJ98D00008 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic 3d inspection
Curve matching
Stereo vision
Wire bond inspection
spellingShingle 3d inspection
Curve matching
Stereo vision
Wire bond inspection
Ong, S.H.
Han, X.
Ye, Q.Z.
3D visual inspection of IC bonding wires
description 10.1117/12.284030
author2 ELECTRICAL ENGINEERING
author_facet ELECTRICAL ENGINEERING
Ong, S.H.
Han, X.
Ye, Q.Z.
format Conference or Workshop Item
author Ong, S.H.
Han, X.
Ye, Q.Z.
author_sort Ong, S.H.
title 3D visual inspection of IC bonding wires
title_short 3D visual inspection of IC bonding wires
title_full 3D visual inspection of IC bonding wires
title_fullStr 3D visual inspection of IC bonding wires
title_full_unstemmed 3D visual inspection of IC bonding wires
title_sort 3d visual inspection of ic bonding wires
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/72434
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