Xiong, Z., Tay, A., & ENGINEERING, M. &. P. (2014). Modeling of viscoelastic effects on interfacial delamination in IC packages.
استشهاد بنمط شيكاغوXiong, Z., A.A.O Tay, و MECHANICAL & PRODUCTION ENGINEERING. Modeling of Viscoelastic Effects On Interfacial Delamination in IC Packages. 2014.
MLA استشهادXiong, Z., A.A.O Tay, و MECHANICAL & PRODUCTION ENGINEERING. Modeling of Viscoelastic Effects On Interfacial Delamination in IC Packages. 2014.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.