APA引文

Liu, J., Wang, W., Wang, L., Chi, D., Loh, K., & CHEMISTRY. (2014). Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials.

Chicago Style Citation

Liu, J., W.D Wang, L. Wang, D.Z Chi, K.P Loh, and CHEMISTRY. Evaluation of PECVD Deposited Boron Nitride As Copper Diffusion Barrier On Porous Low-k Materials. 2014.

MLA引文

Liu, J., et al. Evaluation of PECVD Deposited Boron Nitride As Copper Diffusion Barrier On Porous Low-k Materials. 2014.