Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials

Materials Research Society Symposium Proceedings

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Bibliographic Details
Main Authors: Liu, J., Wang, W.D., Wang, L., Chi, D.Z., Loh, K.P.
Other Authors: CHEMISTRY
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/77439
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Institution: National University of Singapore