Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials
Materials Research Society Symposium Proceedings
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Main Authors: | Liu, J., Wang, W.D., Wang, L., Chi, D.Z., Loh, K.P. |
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Other Authors: | CHEMISTRY |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/77439 |
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Institution: | National University of Singapore |
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