Study of copper diffusion into tantalum nitride (Ta2N) by rapid thermal annealing (RTA)
10.1109/SPI.2002.258309
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Main Authors: | , , , , |
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Other Authors: | |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/116127 |
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Institution: | National University of Singapore |