Study of copper diffusion into tantalum nitride (Ta2N) by rapid thermal annealing (RTA)

Study of copper diffusion into tantalum nitride (Ta2N) by rapid thermal annealing (RTA)

10.1109/SPI.2002.258309

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Bibliographic Details
Main Authors: Loh, S.W., Zhang, D.H., Liu, R., Li, C.Y., Wee, A.T.S.
Other Authors: INSTITUTE OF ENGINEERING SCIENCE
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/116127
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Institution: National University of Singapore
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Summary:10.1109/SPI.2002.258309

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