Study of copper diffusion into tantalum nitride (Ta2N) by rapid thermal annealing (RTA)
10.1109/SPI.2002.258309
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Main Authors: | Loh, S.W., Zhang, D.H., Liu, R., Li, C.Y., Wee, A.T.S. |
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Other Authors: | INSTITUTE OF ENGINEERING SCIENCE |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/116127 |
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Institution: | National University of Singapore |
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