Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS

Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS

Advanced Metallization Conference (AMC)

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Bibliographic Details
Main Authors: Ho, C.S., Liew, S.L., Chan, T.K., Malar, P., Osipowicz, T., Lu, L., Lim, C.Y.H.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
ALD
Cu
High-resolution RBS
TaN
Online Access:http://scholarbank.nus.edu.sg/handle/10635/86065
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/86065

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