Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS

Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS

Advanced Metallization Conference (AMC)

Saved in:
Bibliographic Details
Main Authors: Ho, C.S., Liew, S.L., Chan, T.K., Malar, P., Osipowicz, T., Lu, L., Lim, C.Y.H.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
ALD
Cu
High-resolution RBS
TaN
Online Access:http://scholarbank.nus.edu.sg/handle/10635/86065
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
id sg-nus-scholar.10635-86065
record_format dspace
spelling sg-nus-scholar.10635-860652015-01-17T01:09:40Z Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS Ho, C.S. Liew, S.L. Chan, T.K. Malar, P. Osipowicz, T. Lu, L. Lim, C.Y.H. MECHANICAL ENGINEERING PHYSICS ALD Cu High-resolution RBS TaN Advanced Metallization Conference (AMC) 95-99 MRSPD 2014-10-07T09:15:27Z 2014-10-07T09:15:27Z 2008 Conference Paper Ho, C.S.,Liew, S.L.,Chan, T.K.,Malar, P.,Osipowicz, T.,Lu, L.,Lim, C.Y.H. (2008). Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS. Advanced Metallization Conference (AMC) : 95-99. ScholarBank@NUS Repository. 9781558999923 15401766 http://scholarbank.nus.edu.sg/handle/10635/86065 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
topic ALD
Cu
High-resolution RBS
TaN
spellingShingle ALD
Cu
High-resolution RBS
TaN
Ho, C.S.
Liew, S.L.
Chan, T.K.
Malar, P.
Osipowicz, T.
Lu, L.
Lim, C.Y.H.
Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS
description Advanced Metallization Conference (AMC)
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Ho, C.S.
Liew, S.L.
Chan, T.K.
Malar, P.
Osipowicz, T.
Lu, L.
Lim, C.Y.H.
format Conference or Workshop Item
author Ho, C.S.
Liew, S.L.
Chan, T.K.
Malar, P.
Osipowicz, T.
Lu, L.
Lim, C.Y.H.
author_sort Ho, C.S.
title Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS
title_short Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS
title_full Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS
title_fullStr Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS
title_full_unstemmed Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS
title_sort quantitative studies of copper diffusion through ultra-thin ald tantalum nitride barrier films by high resolution-rbs
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/86065
_version_ 1681089915359592448

Similar Items