Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS
Advanced Metallization Conference (AMC)
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2014
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sg-nus-scholar.10635-860652024-11-15T07:06:49Z Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS Ho, C.S. Liew, S.L. Chan, T.K. Malar, P. Osipowicz, T. Lu, L. Lim, C.Y.H. PHYSICS MECHANICAL ENGINEERING ALD Cu High-resolution RBS TaN Advanced Metallization Conference (AMC) 95-99 MRSPD 2014-10-07T09:15:27Z 2014-10-07T09:15:27Z 2008 Conference Paper Ho, C.S.,Liew, S.L.,Chan, T.K.,Malar, P.,Osipowicz, T.,Lu, L.,Lim, C.Y.H. (2008). Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS. Advanced Metallization Conference (AMC) : 95-99. ScholarBank@NUS Repository. 9781558999923 15401766 http://scholarbank.nus.edu.sg/handle/10635/86065 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| topic |
ALD Cu High-resolution RBS TaN |
| spellingShingle |
ALD Cu High-resolution RBS TaN Ho, C.S. Liew, S.L. Chan, T.K. Malar, P. Osipowicz, T. Lu, L. Lim, C.Y.H. Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS |
| description |
Advanced Metallization Conference (AMC) |
| author2 |
PHYSICS |
| author_facet |
PHYSICS Ho, C.S. Liew, S.L. Chan, T.K. Malar, P. Osipowicz, T. Lu, L. Lim, C.Y.H. |
| format |
Conference or Workshop Item |
| author |
Ho, C.S. Liew, S.L. Chan, T.K. Malar, P. Osipowicz, T. Lu, L. Lim, C.Y.H. |
| author_sort |
Ho, C.S. |
| title |
Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS |
| title_short |
Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS |
| title_full |
Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS |
| title_fullStr |
Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS |
| title_full_unstemmed |
Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS |
| title_sort |
quantitative studies of copper diffusion through ultra-thin ald tantalum nitride barrier films by high resolution-rbs |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/86065 |
| _version_ |
1821205607299940352 |