Quantitative studies of copper diffusion through Ultra-thin ALD tantalum nitride barrier films by high resolution-RBS

Advanced Metallization Conference (AMC)

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Bibliographic Details
Main Authors:	Ho, C.S., Liew, S.L., Chan, T.K., Malar, P., Osipowicz, T., Lu, L., Lim, C.Y.H.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Subjects:	ALD Cu High-resolution RBS TaN
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/86065
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Institution:	National University of Singapore

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