Tantalum based amorphous thin films as copper diffusion barrier

This dissertation presents a study of Ta-based Cu diffusion barrier for advanced semiconductor technology. With the fast development of semiconductor industry, a novel barrier is required in order to address two challenges in the back-end-of-line technology: enhancing the interconnect reliability of...

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Bibliographic Details
Main Author: Yan, Hua
Other Authors: Chen Zhong
Format: Theses and Dissertations
Language:English
Published: 2013
Subjects:
Online Access:https://hdl.handle.net/10356/51780
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Institution: Nanyang Technological University
Language: English