Tantalum based amorphous thin films as copper diffusion barrier

• Main Author: Yan, Hua
• Other Authors: Chen Zhong
• Format: Theses and Dissertations
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
• Online Access: https://hdl.handle.net/10356/51780
• Institution: Nanyang Technological University

This dissertation presents a study of Ta-based Cu diffusion barrier for advanced semiconductor technology. With the fast development of semiconductor industry, a novel barrier is required in order to address two challenges in the back-end-of-line technology: enhancing the interconnect reliability of...