Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials
Materials Research Society Symposium Proceedings
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2014
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sg-nus-scholar.10635-774392024-11-12T21:10:45Z Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials Liu, J. Wang, W.D. Wang, L. Chi, D.Z. Loh, K.P. CHEMISTRY Materials Research Society Symposium Proceedings 812 147-152 MRSPD 2014-06-23T05:55:03Z 2014-06-23T05:55:03Z 2004 Conference Paper Liu, J.,Wang, W.D.,Wang, L.,Chi, D.Z.,Loh, K.P. (2004). Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials. Materials Research Society Symposium Proceedings 812 : 147-152. ScholarBank@NUS Repository. 02729172 http://scholarbank.nus.edu.sg/handle/10635/77439 NOT_IN_WOS Scopus |
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CHEMISTRY |
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CHEMISTRY Liu, J. Wang, W.D. Wang, L. Chi, D.Z. Loh, K.P. |
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Conference or Workshop Item |
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Liu, J. Wang, W.D. Wang, L. Chi, D.Z. Loh, K.P. |
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Liu, J. Wang, W.D. Wang, L. Chi, D.Z. Loh, K.P. Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials |
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Liu, J. |
title |
Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials |
title_short |
Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials |
title_full |
Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials |
title_fullStr |
Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials |
title_full_unstemmed |
Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials |
title_sort |
evaluation of pecvd deposited boron nitride as copper diffusion barrier on porous low-k materials |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/77439 |
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