Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials

Materials Research Society Symposium Proceedings

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Main Authors: Liu, J., Wang, W.D., Wang, L., Chi, D.Z., Loh, K.P.
Other Authors: CHEMISTRY
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/77439
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-774392015-01-29T01:54:47Z Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials Liu, J. Wang, W.D. Wang, L. Chi, D.Z. Loh, K.P. CHEMISTRY Materials Research Society Symposium Proceedings 812 147-152 MRSPD 2014-06-23T05:55:03Z 2014-06-23T05:55:03Z 2004 Conference Paper Liu, J.,Wang, W.D.,Wang, L.,Chi, D.Z.,Loh, K.P. (2004). Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials. Materials Research Society Symposium Proceedings 812 : 147-152. ScholarBank@NUS Repository. 02729172 http://scholarbank.nus.edu.sg/handle/10635/77439 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description Materials Research Society Symposium Proceedings
author2 CHEMISTRY
author_facet CHEMISTRY
Liu, J.
Wang, W.D.
Wang, L.
Chi, D.Z.
Loh, K.P.
format Conference or Workshop Item
author Liu, J.
Wang, W.D.
Wang, L.
Chi, D.Z.
Loh, K.P.
spellingShingle Liu, J.
Wang, W.D.
Wang, L.
Chi, D.Z.
Loh, K.P.
Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials
author_sort Liu, J.
title Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials
title_short Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials
title_full Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials
title_fullStr Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials
title_full_unstemmed Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials
title_sort evaluation of pecvd deposited boron nitride as copper diffusion barrier on porous low-k materials
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/77439
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