Low dielectric constant a-SiOC:H films as copper diffusion barrier

10.1063/1.1530722

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Bibliographic Details
Main Authors: Koh, Y.W., Loh, K.P., Rong, L., Wee, A.T.S., Huang, L., Sudijono, J.
Other Authors: CHEMISTRY
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/53016
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Institution: National University of Singapore