Low dielectric constant a-SiOC:H films as copper diffusion barrier
10.1063/1.1530722
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sg-nus-scholar.10635-530162023-10-31T20:03:31Z Low dielectric constant a-SiOC:H films as copper diffusion barrier Koh, Y.W. Loh, K.P. Rong, L. Wee, A.T.S. Huang, L. Sudijono, J. CHEMISTRY INSTITUTE OF ENGINEERING SCIENCE PHYSICS 10.1063/1.1530722 Journal of Applied Physics 93 2 1241-1245 JAPIA 2014-05-19T02:53:06Z 2014-05-19T02:53:06Z 2003-01-15 Article Koh, Y.W., Loh, K.P., Rong, L., Wee, A.T.S., Huang, L., Sudijono, J. (2003-01-15). Low dielectric constant a-SiOC:H films as copper diffusion barrier. Journal of Applied Physics 93 (2) : 1241-1245. ScholarBank@NUS Repository. https://doi.org/10.1063/1.1530722 00218979 http://scholarbank.nus.edu.sg/handle/10635/53016 000180134200070 Scopus |
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National University of Singapore |
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Asia |
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Singapore Singapore |
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| description |
10.1063/1.1530722 |
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CHEMISTRY |
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CHEMISTRY Koh, Y.W. Loh, K.P. Rong, L. Wee, A.T.S. Huang, L. Sudijono, J. |
| format |
Article |
| author |
Koh, Y.W. Loh, K.P. Rong, L. Wee, A.T.S. Huang, L. Sudijono, J. |
| spellingShingle |
Koh, Y.W. Loh, K.P. Rong, L. Wee, A.T.S. Huang, L. Sudijono, J. Low dielectric constant a-SiOC:H films as copper diffusion barrier |
| author_sort |
Koh, Y.W. |
| title |
Low dielectric constant a-SiOC:H films as copper diffusion barrier |
| title_short |
Low dielectric constant a-SiOC:H films as copper diffusion barrier |
| title_full |
Low dielectric constant a-SiOC:H films as copper diffusion barrier |
| title_fullStr |
Low dielectric constant a-SiOC:H films as copper diffusion barrier |
| title_full_unstemmed |
Low dielectric constant a-SiOC:H films as copper diffusion barrier |
| title_sort |
low dielectric constant a-sioc:h films as copper diffusion barrier |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/53016 |
| _version_ |
1781411835791015936 |