IC WIRE BOND INSPECTION USING ELLIPTICAL MODEL APPROXIMATION.

1850-1851

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Bibliographic Details
Main Authors: Ngan, King N., Kang, Sing B.
Other Authors: ELECTRICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/81461
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Institution: National University of Singapore