Scanning Electron Acoustic Microscopy: A Novel Tool for Failure Analysis & Microcharacterisation

Scanning Electron Acoustic Microscopy: A Novel Tool for Failure Analysis & Microcharacterisation

Conference Proceedings from the International Symposium for Testing and Failure Analysis

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Bibliographic Details
Main Authors: Wong, W.K., Yin, Q.R., Thong, J.T.L., Phang, J.C.H., Fang, J.W.
Other Authors: ELECTRICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/81725
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Institution: National University of Singapore
Description
Summary:Conference Proceedings from the International Symposium for Testing and Failure Analysis

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