發送短信 : Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints

 _    _     ______    _  __    _____    ______   
| \  / ||  /_   _//  | |/ //  |  ___|| |      \\ 
|  \/  ||   -| ||-   | ' //   | ||__   |  --  // 
| .  . ||   _| ||_   | . \\   | ||__   |  --  \\ 
|_|\/|_||  /_____//  |_|\_\\  |_____|| |______// 
`-`  `-`   `-----`   `-` --`  `-----`  `------`