Materials and noncoplanar mesh designs for integrated circuits with linear elastic responses to extreme mechanical deformations

Proceedings of the National Academy of Sciences of the United States of America

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Bibliographic Details
Main Authors: Kim, D.-H., Song, J., Won, M.C., Kim, H.-S., Kim, R.-H., Liu, Z., Huang, Y.Y., Hwang, K.-C., Zhang, Y.-W., Rogers, J.A.
Other Authors: MATERIALS SCIENCE AND ENGINEERING
Published: 2014
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Online Access:http://scholarbank.nus.edu.sg/handle/10635/86522
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Institution: National University of Singapore
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