Void growth and damage ahead of a crack in pressure-sensitive dilatant polymers

WIT Transactions on the Built Environment

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Bibliographic Details
Main Authors: Chew, H.B., Guo, T.F., Cheng, L.
Other Authors: MATERIALS SCIENCE AND ENGINEERING
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/86975
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Institution: National University of Singapore