Effects of immersion zincation to the electroless nickel under-bump materials in microelectronics packaging

Proceedings of the Electronic Packaging Technology Conference, EPTC

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Main Authors:	Ng, Wei-Chin, Ko, Tze-Man, Chen, William, Qi, Guo-Jun
Other Authors:	CHEMICAL ENGINEERING
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/91453
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-91453
record_format	dspace
spelling	sg-nus-scholar.10635-914532015-02-07T19:38:35Z Effects of immersion zincation to the electroless nickel under-bump materials in microelectronics packaging Ng, Wei-Chin Ko, Tze-Man Chen, William Qi, Guo-Jun CHEMICAL ENGINEERING Proceedings of the Electronic Packaging Technology Conference, EPTC 89-94 313 2014-10-09T08:18:15Z 2014-10-09T08:18:15Z 1998 Article Ng, Wei-Chin,Ko, Tze-Man,Chen, William,Qi, Guo-Jun (1998). Effects of immersion zincation to the electroless nickel under-bump materials in microelectronics packaging. Proceedings of the Electronic Packaging Technology Conference, EPTC : 89-94. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/91453 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Proceedings of the Electronic Packaging Technology Conference, EPTC
author2	CHEMICAL ENGINEERING
author_facet	CHEMICAL ENGINEERING Ng, Wei-Chin Ko, Tze-Man Chen, William Qi, Guo-Jun
format	Article
author	Ng, Wei-Chin Ko, Tze-Man Chen, William Qi, Guo-Jun
spellingShingle	Ng, Wei-Chin Ko, Tze-Man Chen, William Qi, Guo-Jun Effects of immersion zincation to the electroless nickel under-bump materials in microelectronics packaging
author_sort	Ng, Wei-Chin
title	Effects of immersion zincation to the electroless nickel under-bump materials in microelectronics packaging
title_short	Effects of immersion zincation to the electroless nickel under-bump materials in microelectronics packaging
title_full	Effects of immersion zincation to the electroless nickel under-bump materials in microelectronics packaging
title_fullStr	Effects of immersion zincation to the electroless nickel under-bump materials in microelectronics packaging
title_full_unstemmed	Effects of immersion zincation to the electroless nickel under-bump materials in microelectronics packaging
title_sort	effects of immersion zincation to the electroless nickel under-bump materials in microelectronics packaging
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/91453
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Effects of immersion zincation to the electroless nickel under-bump materials in microelectronics packaging

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