Electroless Deposition of Copper on Poly(tetrafluoroethylene) Films Modified by Plasma-Induced Surface Grafting of Poly(4-vinylpyridine)

Electroless Deposition of Copper on Poly(tetrafluoroethylene) Films Modified by Plasma-Induced Surface Grafting of Poly(4-vinylpyridine)

10.1023/A:1019934323790

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Bibliographic Details
Main Authors: Wang, W.C., Zhang, Y., Kang, E.T., Neoh, K.G.
Other Authors: CHEMICAL & ENVIRONMENTAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Adhesion
Copper
Electroless plating
Plasma grafting
PTFE: poly(4-vinyl pyridine)
XPS
Online Access:http://scholarbank.nus.edu.sg/handle/10635/91956
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Institution: National University of Singapore
Description
Summary:10.1023/A:1019934323790

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