Electroless plating of palladium and copper on polyaniline films

Electroless plating of palladium and copper on polyaniline films

10.1016/S0379-6779(00)00207-1

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Bibliographic Details
Main Authors: Ma, Z.H., Tan, K.L., Kang, E.T.
Other Authors: CHEMICAL & ENVIRONMENTAL ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/91968
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Institution: National University of Singapore
Description
Summary:10.1016/S0379-6779(00)00207-1

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