APA Citation

Latt, K., Lee, Y., Osipowicz, T., Park, H., & PHYSICS. (2014). Interfacial reactions and failure mechanism of Cu/Ta/SiO2/Si multilayer structure in thermal annealing.

Chicago Style Citation

Latt, K.M., Y.K Lee, T. Osipowicz, H.S Park, and PHYSICS. Interfacial Reactions and Failure Mechanism of Cu/Ta/SiO2/Si Multilayer Structure in Thermal Annealing. 2014.

MLA Citation

Latt, K.M., et al. Interfacial Reactions and Failure Mechanism of Cu/Ta/SiO2/Si Multilayer Structure in Thermal Annealing. 2014.

Warning: These citations may not always be 100% accurate.