Interfacial reactions and failure mechanism of Cu/Ta/SiO2/Si multilayer structure in thermal annealing

Interfacial reactions and failure mechanism of Cu/Ta/SiO2/Si multilayer structure in thermal annealing

10.1016/S0921-5107(02)00093-4

Saved in:
Bibliographic Details
Main Authors: Latt, K.M., Lee, Y.K., Osipowicz, T., Park, H.S.
Other Authors: PHYSICS
Format: Article
Published: 2014
Subjects:
Diffusion barrier
Interfacial reaction
Metallization
Phase transformation
Tantalum (Ta)
Online Access:http://scholarbank.nus.edu.sg/handle/10635/96965
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/96965

Similar Items