Interfacial reactions and failure mechanism of Cu/Ta/SiO2/Si multilayer structure in thermal annealing

Interfacial reactions and failure mechanism of Cu/Ta/SiO2/Si multilayer structure in thermal annealing

10.1016/S0921-5107(02)00093-4

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Main Authors: Latt, K.M., Lee, Y.K., Osipowicz, T., Park, H.S.
Other Authors: PHYSICS
Format: Article
Published: 2014
Subjects:
Diffusion barrier
Interfacial reaction
Metallization
Phase transformation
Tantalum (Ta)
Online Access:http://scholarbank.nus.edu.sg/handle/10635/96965
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-969652023-10-25T22:28:27Z Interfacial reactions and failure mechanism of Cu/Ta/SiO2/Si multilayer structure in thermal annealing Latt, K.M. Lee, Y.K. Osipowicz, T. Park, H.S. PHYSICS Diffusion barrier Interfacial reaction Metallization Phase transformation Tantalum (Ta) 10.1016/S0921-5107(02)00093-4 Materials Science and Engineering B: Solid-State Materials for Advanced Technology 94 1 111-120 MSBTE 2014-10-16T09:29:42Z 2014-10-16T09:29:42Z 2002-06-15 Article Latt, K.M., Lee, Y.K., Osipowicz, T., Park, H.S. (2002-06-15). Interfacial reactions and failure mechanism of Cu/Ta/SiO2/Si multilayer structure in thermal annealing. Materials Science and Engineering B: Solid-State Materials for Advanced Technology 94 (1) : 111-120. ScholarBank@NUS Repository. https://doi.org/10.1016/S0921-5107(02)00093-4 09215107 http://scholarbank.nus.edu.sg/handle/10635/96965 000176024800017 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Diffusion barrier
Interfacial reaction
Metallization
Phase transformation
Tantalum (Ta)
spellingShingle Diffusion barrier
Interfacial reaction
Metallization
Phase transformation
Tantalum (Ta)
Latt, K.M.
Lee, Y.K.
Osipowicz, T.
Park, H.S.
Interfacial reactions and failure mechanism of Cu/Ta/SiO2/Si multilayer structure in thermal annealing
description 10.1016/S0921-5107(02)00093-4
author2 PHYSICS
author_facet PHYSICS
Latt, K.M.
Lee, Y.K.
Osipowicz, T.
Park, H.S.
format Article
author Latt, K.M.
Lee, Y.K.
Osipowicz, T.
Park, H.S.
author_sort Latt, K.M.
title Interfacial reactions and failure mechanism of Cu/Ta/SiO2/Si multilayer structure in thermal annealing
title_short Interfacial reactions and failure mechanism of Cu/Ta/SiO2/Si multilayer structure in thermal annealing
title_full Interfacial reactions and failure mechanism of Cu/Ta/SiO2/Si multilayer structure in thermal annealing
title_fullStr Interfacial reactions and failure mechanism of Cu/Ta/SiO2/Si multilayer structure in thermal annealing
title_full_unstemmed Interfacial reactions and failure mechanism of Cu/Ta/SiO2/Si multilayer structure in thermal annealing
title_sort interfacial reactions and failure mechanism of cu/ta/sio2/si multilayer structure in thermal annealing
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/96965
_version_ 1781786577104535552

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