Properties of electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure

by Latt, K.M., Lee, K., Osipowicz, T., Lee, Y.K.
Published 2014

Interfacial reactions and failure mechanism of Cu/Ta/SiO2/Si multilayer structure in thermal annealing

by Latt, K.M., Lee, Y.K., Osipowicz, T., Park, H.S.
Published 2014

Study of diffusion barrier properties of ternary alloy (TixAlyNz) in Cu/TixAlyNz/SiO2/Si thin film structure

by Lee, Y.K., Latt, K.M., Osipowicz, T., Sher-Yi, C.
Published 2014

Diffusion barrier properties of ionized metal plasma deposited tantalum nitride thin films between copper and silicon dioxide

by Latt, K.M., Lee, Y.K., Seng, H.L., Osipowicz, T.
Published 2014

The impact of layer thickness of IMP-deposited tantalum nitride films on integrity of Cu/TaN/SiO2/Si multilayer structure

by Latt, K.M., Lee, Y.K., Li, S., Osipowicz, T., Seng, H.L.
Published 2014

Comparative study of copper films prepared by ionized metal plasma sputtering and chemical vapor deposition in the Cu/TaN/SiO2/Si multilayer structure

by Latt, K.M., Sher-Yi, C., Osipowicz, T., Lee, K., Lee, Y.K.
Published 2014

Study on SiNx passivated Cu/Ta/SiO2/Si multilayer structure

by Latt, K.M., Park, H.S., Seng, H.L., Osipowicz, T., Lee, Y.K.
Published 2014

Effect of the silicon nitride passivation layer on the Cu/Ta/SiO2/Si multi-layer structure

by Latt, K.M., Park, H.S., Seng, H.L., Osipowicz, T., Lee, Y.K., Li, S.
Published 2014

Study of interfacial reactions in ionized metal plasma (IMP) deposited Al-0.5%wt Cu/Ti/SiO2Si structure

by Lee, Y.K., Latt, K.M., Jaehyung, K., Osipowicz, T., Chiam, S.-Y., Lee, K.
Published 2014

Comparative analysis and study of ionized metal plasma (IMP)-Cu and chemical vapor deposition (CVD)-Cu on diffusion barrier properties of IMP-TaN on SiO2

by Lee, Y.K., Latt, K.M., JaeHyung, K., Osipowicz, T., Sher-Yi, C., Lee, K.
Published 2014