Interfacial reactions and failure mechanism of Cu/Ta/SiO2/Si multilayer structure in thermal annealing

بواسطة Latt, K.M., Lee, Y.K., Osipowicz, T., Park, H.S.
منشور في 2014

Properties of electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure

بواسطة Latt, K.M., Lee, K., Osipowicz, T., Lee, Y.K.
منشور في 2014

Diffusion barrier properties of ionized metal plasma deposited tantalum nitride thin films between copper and silicon dioxide

بواسطة Latt, K.M., Lee, Y.K., Seng, H.L., Osipowicz, T.
منشور في 2014

Study of diffusion barrier properties of ternary alloy (TixAlyNz) in Cu/TixAlyNz/SiO2/Si thin film structure

بواسطة Lee, Y.K., Latt, K.M., Osipowicz, T., Sher-Yi, C.
منشور في 2014

The impact of layer thickness of IMP-deposited tantalum nitride films on integrity of Cu/TaN/SiO2/Si multilayer structure

بواسطة Latt, K.M., Lee, Y.K., Li, S., Osipowicz, T., Seng, H.L.
منشور في 2014

Comparative study of copper films prepared by ionized metal plasma sputtering and chemical vapor deposition in the Cu/TaN/SiO2/Si multilayer structure

بواسطة Latt, K.M., Sher-Yi, C., Osipowicz, T., Lee, K., Lee, Y.K.
منشور في 2014

Study on SiNx passivated Cu/Ta/SiO2/Si multilayer structure

بواسطة Latt, K.M., Park, H.S., Seng, H.L., Osipowicz, T., Lee, Y.K.
منشور في 2014

Study of interfacial reactions in ionized metal plasma (IMP) deposited Al-0.5%wt Cu/Ti/SiO2Si structure

بواسطة Lee, Y.K., Latt, K.M., Jaehyung, K., Osipowicz, T., Chiam, S.-Y., Lee, K.
منشور في 2014

Effect of the silicon nitride passivation layer on the Cu/Ta/SiO2/Si multi-layer structure

بواسطة Latt, K.M., Park, H.S., Seng, H.L., Osipowicz, T., Lee, Y.K., Li, S.
منشور في 2014

Comparative analysis and study of ionized metal plasma (IMP)-Cu and chemical vapor deposition (CVD)-Cu on diffusion barrier properties of IMP-TaN on SiO2

بواسطة Lee, Y.K., Latt, K.M., JaeHyung, K., Osipowicz, T., Sher-Yi, C., Lee, K.
منشور في 2014