Interfacial reactions and failure mechanism of Cu/Ta/SiO2/Si multilayer structure in thermal annealing
10.1016/S0921-5107(02)00093-4
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Main Authors: | Latt, K.M., Lee, Y.K., Osipowicz, T., Park, H.S. |
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Other Authors: | PHYSICS |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/96965 |
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Institution: | National University of Singapore |
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