Thermal stability of Cu/α-Ta/SiO2/Si structures

Thermal stability of Cu/α-Ta/SiO2/Si structures

10.1016/j.tsf.2004.05.057

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Bibliographic Details
Main Authors: Yuan, Z.L., Zhang, D.H., Li, C.Y., Prasad, K., Tan, C.M.
Other Authors: CHEMICAL & BIOMOLECULAR ENGINEERING
Format: Article
Published: 2014
Subjects:
α-Ta
Cu metallization
Diffusion barrier
SiO2
Thermal stability
Online Access:http://scholarbank.nus.edu.sg/handle/10635/90377
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/90377

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