Electrochemical deposition of copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features

Electrochemical deposition of copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features

10.1023/A:1013872107905

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Bibliographic Details
Main Authors: Li, W.H., Ye, J.H., Li, S.F.Y.
Other Authors: CHEMISTRY
Format: Article
Published: 2014
Subjects:
Cu electroplating
Cu interconnect
Electrochemical deposition of Cu
TaN barrier and integrated circuit
Online Access:http://scholarbank.nus.edu.sg/handle/10635/93698
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/93698

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