Electrochemical deposition of copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features

Electrochemical deposition of copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features

10.1023/A:1013872107905

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Main Authors: Li, W.H., Ye, J.H., Li, S.F.Y.
Other Authors: CHEMISTRY
Format: Article
Published: 2014
Subjects:
Cu electroplating
Cu interconnect
Electrochemical deposition of Cu
TaN barrier and integrated circuit
Online Access:http://scholarbank.nus.edu.sg/handle/10635/93698
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-936982023-10-29T21:15:03Z Electrochemical deposition of copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features Li, W.H. Ye, J.H. Li, S.F.Y. CHEMISTRY Cu electroplating Cu interconnect Electrochemical deposition of Cu TaN barrier and integrated circuit 10.1023/A:1013872107905 Journal of Applied Electrochemistry 31 12 1395-1397 JAELB 2014-10-16T08:27:20Z 2014-10-16T08:27:20Z 2001-12 Article Li, W.H., Ye, J.H., Li, S.F.Y. (2001-12). Electrochemical deposition of copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features. Journal of Applied Electrochemistry 31 (12) : 1395-1397. ScholarBank@NUS Repository. https://doi.org/10.1023/A:1013872107905 0021891X http://scholarbank.nus.edu.sg/handle/10635/93698 000173467900017 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Cu electroplating
Cu interconnect
Electrochemical deposition of Cu
TaN barrier and integrated circuit
spellingShingle Cu electroplating
Cu interconnect
Electrochemical deposition of Cu
TaN barrier and integrated circuit
Li, W.H.
Ye, J.H.
Li, S.F.Y.
Electrochemical deposition of copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features
description 10.1023/A:1013872107905
author2 CHEMISTRY
author_facet CHEMISTRY
Li, W.H.
Ye, J.H.
Li, S.F.Y.
format Article
author Li, W.H.
Ye, J.H.
Li, S.F.Y.
author_sort Li, W.H.
title Electrochemical deposition of copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features
title_short Electrochemical deposition of copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features
title_full Electrochemical deposition of copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features
title_fullStr Electrochemical deposition of copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features
title_full_unstemmed Electrochemical deposition of copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features
title_sort electrochemical deposition of copper on patterned cu/ta(n)/sio2 surfaces for super filling of sub-micron features
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/93698
_version_ 1781785962368466944

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