Electrochemical deposition of copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features

• Main Authors: Li, W.H., Ye, J.H., Li, S.F.Y.
• Other Authors: CHEMISTRY
• Format: Article
• Published: 2014
• Subjects: Cu electroplating; Cu interconnect; Electrochemical deposition of Cu; TaN barrier and integrated circuit
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/93698
• Institution: National University of Singapore

10.1023/A:1013872107905