Trends in bonding configuration at SiC/III-V semiconductor interfaces

10.1063/1.1402162

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Main Authors:	Zheng, J.-C., Wang, H.-Q., Wee, A.T.S., Huan, C.H.A.
Other Authors:	PHYSICS
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/98457
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-98457
record_format	dspace
spelling	sg-nus-scholar.10635-984572023-10-26T09:46:11Z Trends in bonding configuration at SiC/III-V semiconductor interfaces Zheng, J.-C. Wang, H.-Q. Wee, A.T.S. Huan, C.H.A. PHYSICS 10.1063/1.1402162 Applied Physics Letters 79 11 1643-1645 APPLA 2014-10-16T09:47:19Z 2014-10-16T09:47:19Z 2001-09-10 Article Zheng, J.-C., Wang, H.-Q., Wee, A.T.S., Huan, C.H.A. (2001-09-10). Trends in bonding configuration at SiC/III-V semiconductor interfaces. Applied Physics Letters 79 (11) : 1643-1645. ScholarBank@NUS Repository. https://doi.org/10.1063/1.1402162 00036951 http://scholarbank.nus.edu.sg/handle/10635/98457 000170800700020 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1063/1.1402162
author2	PHYSICS
author_facet	PHYSICS Zheng, J.-C. Wang, H.-Q. Wee, A.T.S. Huan, C.H.A.
format	Article
author	Zheng, J.-C. Wang, H.-Q. Wee, A.T.S. Huan, C.H.A.
spellingShingle	Zheng, J.-C. Wang, H.-Q. Wee, A.T.S. Huan, C.H.A. Trends in bonding configuration at SiC/III-V semiconductor interfaces
author_sort	Zheng, J.-C.
title	Trends in bonding configuration at SiC/III-V semiconductor interfaces
title_short	Trends in bonding configuration at SiC/III-V semiconductor interfaces
title_full	Trends in bonding configuration at SiC/III-V semiconductor interfaces
title_fullStr	Trends in bonding configuration at SiC/III-V semiconductor interfaces
title_full_unstemmed	Trends in bonding configuration at SiC/III-V semiconductor interfaces
title_sort	trends in bonding configuration at sic/iii-v semiconductor interfaces
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/98457
_version_	1781786879263244288

Trends in bonding configuration at SiC/III-V semiconductor interfaces

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