Silent compiler bug de-duplication via three-dimensional analysis

Compiler testing is an important task for assuring the quality of compilers, but investigating test failures is very time-consuming. This is because many test failures are caused by the same compiler bug (known as bug duplication problem). In particular, this problem becomes much more challenging on...

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Main Authors: YANG, Chen, CHEN, Junjie, FAN, Xingyu, JIANG, Jiajun, SUN, Jun
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Language:English
Published: Institutional Knowledge at Singapore Management University 2023
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Online Access:https://ink.library.smu.edu.sg/sis_research/8149
https://ink.library.smu.edu.sg/context/sis_research/article/9152/viewcontent/3597926.3598087.pdf
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Institution: Singapore Management University
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spelling sg-smu-ink.sis_research-91522024-02-16T02:46:44Z Silent compiler bug de-duplication via three-dimensional analysis YANG, Chen CHEN, Junjie FAN, Xingyu JIANG, Jiajun SUN, Jun Compiler testing is an important task for assuring the quality of compilers, but investigating test failures is very time-consuming. This is because many test failures are caused by the same compiler bug (known as bug duplication problem). In particular, this problem becomes much more challenging on silent compiler bugs (also called wrong code bugs), since these bugs can provide little information (unlike crash bugs that can produce error messages) for bug de-duplication. In this work, we propose a novel technique (called D3) to solve the duplication problem on silent compiler bugs. Its key insight is to characterize the silent bugs from the testing process and identify three-dimensional information (i.e., test program, optimizations, and test execution) for bug de-duplication. However, there are huge amount of bug-irrelevant details on the three dimensions, D3 then systematically conducts causal analysis to identify bug-causal features from each of the three dimensions for more accurate bug de-duplication. Finally, D3 ranks the test failures that are more likely to be caused by different silent bugs higher by measuring the distance among test failures based on the three-dimensional bug-causal features. Our experimental results on four datasets (including duplicate bugs of both GCC and LLVM) demonstrate the significant superiority of D3 over the two state-of-the-art compiler bug de-duplication techniques, achieving the average improvement of 19.36% and 51.43% in identifying unique silent compiler bugs when analyzing the same number of test failures. 2023-07-01T07:00:00Z text application/pdf https://ink.library.smu.edu.sg/sis_research/8149 info:doi/10.1145/3597926.3598087 https://ink.library.smu.edu.sg/context/sis_research/article/9152/viewcontent/3597926.3598087.pdf http://creativecommons.org/licenses/by-nc-nd/4.0/ Research Collection School Of Computing and Information Systems eng Institutional Knowledge at Singapore Management University Software and its engineering Software creation and management Software verification and validation Software defect analysis Software testing and debugging Software Engineering
institution Singapore Management University
building SMU Libraries
continent Asia
country Singapore
Singapore
content_provider SMU Libraries
collection InK@SMU
language English
topic Software and its engineering
Software creation and management
Software verification and validation
Software defect analysis
Software testing and debugging
Software Engineering
spellingShingle Software and its engineering
Software creation and management
Software verification and validation
Software defect analysis
Software testing and debugging
Software Engineering
YANG, Chen
CHEN, Junjie
FAN, Xingyu
JIANG, Jiajun
SUN, Jun
Silent compiler bug de-duplication via three-dimensional analysis
description Compiler testing is an important task for assuring the quality of compilers, but investigating test failures is very time-consuming. This is because many test failures are caused by the same compiler bug (known as bug duplication problem). In particular, this problem becomes much more challenging on silent compiler bugs (also called wrong code bugs), since these bugs can provide little information (unlike crash bugs that can produce error messages) for bug de-duplication. In this work, we propose a novel technique (called D3) to solve the duplication problem on silent compiler bugs. Its key insight is to characterize the silent bugs from the testing process and identify three-dimensional information (i.e., test program, optimizations, and test execution) for bug de-duplication. However, there are huge amount of bug-irrelevant details on the three dimensions, D3 then systematically conducts causal analysis to identify bug-causal features from each of the three dimensions for more accurate bug de-duplication. Finally, D3 ranks the test failures that are more likely to be caused by different silent bugs higher by measuring the distance among test failures based on the three-dimensional bug-causal features. Our experimental results on four datasets (including duplicate bugs of both GCC and LLVM) demonstrate the significant superiority of D3 over the two state-of-the-art compiler bug de-duplication techniques, achieving the average improvement of 19.36% and 51.43% in identifying unique silent compiler bugs when analyzing the same number of test failures.
format text
author YANG, Chen
CHEN, Junjie
FAN, Xingyu
JIANG, Jiajun
SUN, Jun
author_facet YANG, Chen
CHEN, Junjie
FAN, Xingyu
JIANG, Jiajun
SUN, Jun
author_sort YANG, Chen
title Silent compiler bug de-duplication via three-dimensional analysis
title_short Silent compiler bug de-duplication via three-dimensional analysis
title_full Silent compiler bug de-duplication via three-dimensional analysis
title_fullStr Silent compiler bug de-duplication via three-dimensional analysis
title_full_unstemmed Silent compiler bug de-duplication via three-dimensional analysis
title_sort silent compiler bug de-duplication via three-dimensional analysis
publisher Institutional Knowledge at Singapore Management University
publishDate 2023
url https://ink.library.smu.edu.sg/sis_research/8149
https://ink.library.smu.edu.sg/context/sis_research/article/9152/viewcontent/3597926.3598087.pdf
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