Laser microvia formation in polyimide thin films for metallization applications
Purpose - The purpose of this paper is to demonstrate laser microvia drilling of polyimide thin films from multiple sources before metallic sputtering. This process flow reduces Flexible Printed Circuit Board (FPCB) material, chemical and operational costs by 90 per cent in the construction of flexi...
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格式: | 雜誌 |
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2017
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在線閱讀: | https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=82255173610&origin=inward http://cmuir.cmu.ac.th/jspui/handle/6653943832/42943 |
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