External-electric-field-enhanced uniformity and deposition rate of a TiO<inf>2</inf>film prepared by the sparking process
© W. THONGPAN, T. KUMPIKA, E. KANTARAK, A. PANTHAWAN, P. POOSEEKHEAW, P. SINGJAI, A. TUANTRANONT, W. THONGSUWAN, 2018. We have used an external electric field to increase both the uniformity and deposition rate of TiO2films. The experiment is carried out by sparking-off titanium wires with a high dc...
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th-cmuir.6653943832-591322018-09-05T04:38:53Z External-electric-field-enhanced uniformity and deposition rate of a TiO<inf>2</inf>film prepared by the sparking process W. Thongpan T. Kumpika E. Kantarak A. Panthawan P. Pooseekheaw P. Singjai A. Tuantranont W. Thongsuwan Physics and Astronomy © W. THONGPAN, T. KUMPIKA, E. KANTARAK, A. PANTHAWAN, P. POOSEEKHEAW, P. SINGJAI, A. TUANTRANONT, W. THONGSUWAN, 2018. We have used an external electric field to increase both the uniformity and deposition rate of TiO2films. The experiment is carried out by sparking-off titanium wires with a high dc voltage of 1 kV (field Eint= 10 kV/cm) and a limited current of 3 mA. The external electric fields (Eext) of 3, 6, and 9 kV/cm were applied to the sparking system for 1–5 hours. The as-deposited film morphology was characterized by scanning electron microscopy. The results clearly show that the films are only deposited on the external electric field area. Furthermore, the deposition rate of the films increased from 40.7% to 77.8% in the presence of the external electric field of 9 kV/cm. The effects of an external electric field on both the deposition rate and uniformity of films are investigated and described. 2018-09-05T04:38:53Z 2018-09-05T04:38:53Z 2018-07-12 Journal 20710194 20710186 2-s2.0-85050258400 10.15407/ujpe63.6.531 https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85050258400&origin=inward http://cmuir.cmu.ac.th/jspui/handle/6653943832/59132 |
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Physics and Astronomy W. Thongpan T. Kumpika E. Kantarak A. Panthawan P. Pooseekheaw P. Singjai A. Tuantranont W. Thongsuwan External-electric-field-enhanced uniformity and deposition rate of a TiO<inf>2</inf>film prepared by the sparking process |
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© W. THONGPAN, T. KUMPIKA, E. KANTARAK, A. PANTHAWAN, P. POOSEEKHEAW, P. SINGJAI, A. TUANTRANONT, W. THONGSUWAN, 2018. We have used an external electric field to increase both the uniformity and deposition rate of TiO2films. The experiment is carried out by sparking-off titanium wires with a high dc voltage of 1 kV (field Eint= 10 kV/cm) and a limited current of 3 mA. The external electric fields (Eext) of 3, 6, and 9 kV/cm were applied to the sparking system for 1–5 hours. The as-deposited film morphology was characterized by scanning electron microscopy. The results clearly show that the films are only deposited on the external electric field area. Furthermore, the deposition rate of the films increased from 40.7% to 77.8% in the presence of the external electric field of 9 kV/cm. The effects of an external electric field on both the deposition rate and uniformity of films are investigated and described. |
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W. Thongpan T. Kumpika E. Kantarak A. Panthawan P. Pooseekheaw P. Singjai A. Tuantranont W. Thongsuwan |
author_facet |
W. Thongpan T. Kumpika E. Kantarak A. Panthawan P. Pooseekheaw P. Singjai A. Tuantranont W. Thongsuwan |
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W. Thongpan |
title |
External-electric-field-enhanced uniformity and deposition rate of a TiO<inf>2</inf>film prepared by the sparking process |
title_short |
External-electric-field-enhanced uniformity and deposition rate of a TiO<inf>2</inf>film prepared by the sparking process |
title_full |
External-electric-field-enhanced uniformity and deposition rate of a TiO<inf>2</inf>film prepared by the sparking process |
title_fullStr |
External-electric-field-enhanced uniformity and deposition rate of a TiO<inf>2</inf>film prepared by the sparking process |
title_full_unstemmed |
External-electric-field-enhanced uniformity and deposition rate of a TiO<inf>2</inf>film prepared by the sparking process |
title_sort |
external-electric-field-enhanced uniformity and deposition rate of a tio<inf>2</inf>film prepared by the sparking process |
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2018 |
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https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85050258400&origin=inward http://cmuir.cmu.ac.th/jspui/handle/6653943832/59132 |
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